3D Integration for VLSI Systems

Table of contents

1. Cover
2. Half Title
3. Title
4. Copyright
5. Preface
6. Contents
7. Chapter 1 3D Integration Technology - Introduction and Overview
8. Chapter 2 A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
9. Chapter 3 Wafer Bonding Techniques
10. Chapter 4 TSV Etching
11. Chapter 5 TSV Filling
12. Chapter 6 3D Technology Platform: Temporary Bonding and Release
13. Chapter 7 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
14. Chapter 8 Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
15. Chapter 9 Advanced Direct Bond Technology
16. Chapter 10 Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration
17. Chapter 11 Through Silicon Via Implementation in CMOS Image Sensor Product
18. Chapter 12 A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through-Silicon Via and Hybrid Cu-Adhesive Bonding
19. Chapter 13 Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells
20. Chapter 14 Thermal-Aware 3D IC Designs
21. Chapter 15 3D IC Design Automation Considering Dynamic Power and Thermal Integrity
22. Chapter 16 Outlook
23. Index