3D Integration for VLSI Systems

Chapter 7 3D TECHNOLOGY PLATFORM - WAFER THINNING, STRESS RELIEF, AND THIN WAFER HANDLING

Scott Sullivan

DISCO

7.1 INTRODUCTION

Throughout the history of the semiconductor industry new methods for integrating devices have been created. Most if not all methods have been to improve performance and reduce costs. What is particularly exciting about so called 3D integration is that it involves both front end and backend processes. This paper assumes that there is no clearly defined process flow as of yet leaving the way open for each process to change position in the process flow The two processes circled below in Figure 7.1 is addressed separately.

Fig. 7.1

7.2 EDGE TRIMMING

As wafers are thinned, the shape of the wafer edge changes. ...