3D Integration for VLSI Systems

Chapter 15 3D IC DESIGN AUTOMATION CONSIDERING DYNAMIC POWER AND THERMAL INTEGRITY

Hao Yu and Xiwei Huang

Nanyang Technological University, Singapore

15.1 INTRODUCTION

The high-performance VLSI integration by the technology scaling has been confronted with the dramatically increased design cost resulting from noise, power and process variation. System integration has emerged as an alternative design paradigm to improve performance by increasing the throughput. However, in today’s two dimensional (2D) Systems-on-chip (SoC) integration, the memory is surrounded by logic circuits and its performance, in terms of, is limited by the length of long interconnect. Thanks to the recent advance in three dimensional (3D) integration^{2, 4 5 9 14, ...}