April 2016
Intermediate to advanced
350 pages
11h 35m
English
Content preview from 3D Integration for VLSI Systems
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Contents
Chapter 1 3D Integration Technology - Introduction and Overview
Chapter 2 A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
Chapter 3 Wafer Bonding Techniques
Chapter 6 3D Technology Platform: Temporary Bonding and Release
Chapter 7 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
Chapter 8 Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
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