3D Integration for VLSI Systems

Preface

Three-dimensional (3D) integration has emerged as a critical performance enabler for integrated circuits, at a time when the microelectornics industry is faced with unprecedented scaling barriers, which have arisen both due to fundamental physics and economic constraints. 3D integration provides a mechanism for space transformation of the traditional planar implementation of integrated circuits into three-dimensional space. It therefore provides a pathway to extend geometrical scaling for further performance enhancement (“More Moore”), as well as provide functional diversification (“More than Moore”) to improve higher-level system operation. At its core, 3D integration is simply the process of vertically stacking of circuits and forming ...