In this chapter, basic concepts regarding the metallic interconnections used in very-large-scale integration (VLSI) circuits are presented. Here are the chapter objectives:
• After going through section 1.1, students should be familiar with the various types of metallic interconnections employed in VLSI applications. They should understand the advantages and challenges posed by the copper interconnections and be familiar with the techniques used for their fabrication.
• After going through section 1.2, students should be able to model a resistive metallic interconnection as a ladder network.
• After going through section 1.3, students should be familiar with the various propagation modes that can exist ...