Anisotropic conductive adhesives in electronics
J.W.C. De Vries and J.F.J.M. Caers, Philips Applied Technologies, The Netherlands
This chapter presents an industrial approach to anisotropic conductive adhesive interconnection technology. The focus is on the long- term performance for this type of electrical interconnection as an alternative to soldered joints of very fine pitch (less than 100 μm). Beginning with a brief description of what an adhesive bond actually is, as compared with a soldered joint, the most important material properties and the critical stress factors are considered. They are illustrated by discussing some case studies: heat seal connectors and ultra-thin ball grid array packages.