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Underfill adhesive materials for flip chip applications

Q.K. Tong,     Henkel Corporation, USA

Abstract:

The advance of the semiconductor industry requires smaller and lighter micro-electronic packages with faster and more reliable electronic performance. Accordingly, flip chip technology, a direct chip attachment (DCA) technology that directly connects the circuitries between the silicon chip and the substrate, has been the fastest growing packaging in the semiconductor industry. Over the last decade it has also developed into many technology platforms, such as chip scale packaging (CSP) and multichip packaging. The reliability challenge of this new packaging technology was realized almost immediately and organic reinforcing materials ...

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