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Modelling techniques used to assess conductive adhesive properties

C. Bailey,     University of Greenwich, UK

Abstract:

Modelling techniques are now routinely used to help understand the manufacturability and performance of conductive adhesives when used in electronic, photonic and microsystems packaging. This chapter reviews the latest advances of the techniques for structural and conductive adhesives.

Key words

process modelling

finite element analysis

optimisation

7.1 Introduction

Increasing global competition is a significant factor affecting the design of modern electronic and photonic products. While the product development time for electronic systems in the early 1980s was often years, portable computing and consumer products ...

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