Book description
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies.
The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Table of contents
- Cover
- Title Page
- Copyright
- Preface
- Contributors
-
Part I: Digital Design and Power Management
- Chapter 1: Design in the Energy–Delay Space
- Chapter 2: Subthreshold Source-Coupled Logic
-
Chapter 3: Ultralow-Voltage Design of Nanometer CMOS Circuits for Smart Energy-Autonomous Systems
- 3.1 Introduction
- 3.2 Impact of Technology Scaling on Subthreshold MOSFET Characteristics
- 3.3 Scaling Trend of the Minimum-Energy Point
- 3.4 Practical Energy of Nanometer ULV Circuits under Robustness and Timing Constraints
- 3.5 Technology/Circuit Methodology and Roadmap for ULV Design in the Nanometer Era
- 3.6 Conclusion
- Acknowledgment
- References
- Chapter 4: Impairment-Aware Analog Circuit Design by Reconfiguring Feedback Systems
- Chapter 5: Rom-Based Logic Design: A Low-Power Design Perspective
- Chapter 6: Power Management: Enabling Technology
- Chapter 7: Ultralow Power Management Circuit for Optimal Energy Harvesting in Wireless Body Area Network
-
Part II: Analog and RF Design
-
Chapter 8: Analog Circuit Design for SOI
- 8.1 SOI Devices
- 8.2 Partially Depleted SOI
- 8.3 FDSOI and fINFET
- 8.4 Device Considerations (FDSOI AND PDSOI)
- 8.5 Analog Circuit Building Blocks
- 8.6 Operational Amplifiers
- 8.7 Operational Transconductance Amplifier
- 8.8 Radio Frequency Low-Noise Amplifier
- 8.9 Mixers and Analog Multipliers
- 8.10 Analog to Digital and Digital to Analog Converters
- 8.11 Summary
- References
- Chapter 9: Frequency Generation and Control With Self-Referenced CMOS Oscillators
- Chapter 10: Synthesis of Static and Dynamic Translinear Circuits
- Chapter 11: Microwatt Power Cmos Analog Circuit Designs: Ultralow Power Lsis for Power-Aware Applications
- Chapter 12: High-Speed Current-Mode Data Drivers for Amoled Displays
- Chapter 13: RF Transceivers for Wireless Applications
-
Chapter 8: Analog Circuit Design for SOI
-
Part III: Device Layout and Reliability
- Chapter 14: Technology-Aware Communication Architecture Design for Parallel Hardware Platforms
- Chapter 15: Design and Optimization of Integrated Transmission Lines on Scaled CMOS Technologies
- Chapter 16: On-Chip Surfing Interconnect
- Chapter 17: On-Chip Spiral Inductors With Integrated Magnetic Materials
- Chapter 18: Reliability of Nanoelectronic VLSI
-
Chapter 19: Temperature Monitoring Issues in Nanometer CMOS Integrated Circuits
- 19.1 Introduction
- 19.2 From Where Does Heat Come in Nanometer Circuits?
- 19.3 Harmful Effects Due to Temperature in VLSI Chips
- 19.4 Temperature Sensing for DTM
- 19.5 Thermal Modeling
- 19.6 Thermal Sensor Placement and Allocation
- 19.7 Temperature Monitoring Networks
- 19.8 Conclusions
- Acknowledgments
- References
-
Part IV: Circuit Testing
- Chapter 20: Low-Power Testing for Low-Power LSI Circuits
- Chapter 21: Checkers for Online Self-Testing of Analog Circuits
- Chapter 22: Design and Test of Robust CMOS RF and MM-Wave Radios
-
Chapter 23: Contactless Testing and Diagnosis Techniques
- 23.1 Introduction
- 23.2 Electron-Beam Method
- 23.3 Photoemissive Probing
- 23.4 Electro-Optic Probing
- 23.5 Charge Density Probing
- 23.6 Photoexcitation Probe Techniques
- 23.7 Electric Force Microscopy
- 23.8 Capacitive Coupling Method
- 23.9 Dynamic Internal Testing of CMOS using Hot-Carrier Luminescence
- 23.10 All-Silicon Optical Contactless Testing of Integrated Circuits
- 23.11 Conclusion
- References
- Index
Product information
- Title: Advanced Circuits for Emerging Technologies
- Author(s):
- Release date: May 2012
- Publisher(s): Wiley
- ISBN: 9781118181478
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