13The Role of Liquid Molding Compounds in the Success of Fan‐Out Wafer‐Level Packaging Technology

Katsushi Kan1, Michiyasu Sugahara2, and Markus Cichon3

1Nagase ChemteX Corporation

2Nagase & Co., LTD.

3Nagase (Europa) GmbH

13.1 Introduction

Semiconductor packaging technologies are state of the art for various industries and applications including automotive, machinery, entertainment, communication, sensor, security, authentication, medical and environment systems, and many more. Today, many variations of electronics are available, and indeed the entire world and environment could not function without these in the manner that people have become used to. Recently, fan‐out wafer‐level packaging (FO‐WLP) has attracted attention as a high performance and very cost‐efficient packaging solution [1]. This packaging is highly suitable for wireless devices, most common in mobile and automotive sensor applications [2]. Nagase, as a diversified epoxy material supplier, began active development for these applications in the mid‐2000s, and LMC was successfully implemented into FO‐WLP at the end of 2007.

Epoxy resin has two specific features: excellent adhesion to various surfaces and superb electrical insulation. Therefore, epoxy compounds became a very popular encapsulant for semiconductor packaging some time ago. During its development history, epoxy compound encapsulant has been used in many different forms of packaging in various applications with very specific requirements. Generally, ...

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