Appendix D

Process Parameters and Chips Specifications

D.1 AMS 0.8 μm BiCMOS Process

The AustriaMicroSystems AMS 0.8 μm BiCMOS process is a mixed analog/digital process and offers the implementation of a generic npn–bipolar transistor. The process provides two metal layers and two layers of low ohmic polysilicon (poly) to form poly/poly capacitors. The substrate is acceptor doped (p−) and the gates consist of heavily donor-doped polysilicon (n+). This process was available through the multi-project-wafer (MPW) service provided by Europractice (www.europractice.com). The most important process parameters are listed in Table D.1.

Table D.1 AMS 0.8 μm BiCMOS process parameters.

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D.2 Chip Specifications

Table D.2 Specification of the three visual motion chips presented in this book.

The smooth optical flow chip
Die size(s) 2.55 × 2.55 mm2 / 4.72 × 4.5 mm2
Array size(s) (motion units) 10 × 10/30 × 30
Pixel size 124 × 124 μm2
Active elements 119
Power dissipation 52 μW
Outputs (scanned) optical flow, photoreceptor
Typical read-out speed 1000 frames/s
The motion segmentation chip
Die size 2.7 × 2.95 mm2
Array size (motion units) 11 × 11
Pixel size 170 × 170 μm2
Active elements (per pixel) 203
Fill factora 2.1%
Power dissipation (per pixel) 80 μW
Outputs signals (scanned) 5: photoreceptor, optical flow, P and Q
Max. read-out speed ≈10, 000 frames/s

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