Appendix E

References by subject

Component package types and mounting (surface-mounted device)

  • IPC-7351B, Section 8.0-16.0, pp. 54–86.

Component placement, spacing, and orientation

General considerations

  • IPC-1902 (grid resolution considerations).
  • IPC-2221B, Section 7.2.4, p. 68; Section 8.1, p. 73–78.
  • IPC-7351B, Section 3.4, p. 31 (SMD).
  • IPC-AJ-820A. Assembly and Joining Handbook.
  • IPC-CM-770E, Section 8.1, p. 44.
  • Coombs, C. F., Jr. (2001). Coombs’ printed circuits handbook (5th ed.). New York: McGraw-Hill. Section 49.4.


  • Avoiding passive-component pitfalls, Doug Grant and Scott Wurcer, Analog Devices Application Note AN-348.
  • Biasing and decoupling op amps in single supply applications, Charles Kitchin, Analog Devices Application ...

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