Appendix E. References by Subject
Component Package Types and Mounting (SMD)
IPC-7351, Section 8.0, pp. 44–70.
IPC-D-330, Section 5.
(see also Land Patterns)
Component Placement, Spacing, and Orientation
General Considerations
IPC-1902 (grid resolution considerations).
IPC-2221A
IPC-2221A, Section 7.2.3, p. 51; Section 8.0, p. 55.
IPC-7351, Section 3.4, p. 20 (SMD).
IPC-AJ-820.
IPC-CM-770E
IPC-CM-770E, Section 8.1, p. 44.
IPC-D-330, Fig. 11-64, p. 65.
ClydeF. Coombs Jr.,
Coombs’ Printed Circuits Handbook.
5th ed. (
2001)
McGraw-Hill,
New York;
Section 49.4.
Capacitors/Bypassing/Placement
Avoiding Passive-Component Pitfalls, Doug Grant and Scott Wurcer, Analog Devices Application Note AN-348.
Biasing
Biasing and Decoupling Op Amps in Single Supply Applications ...
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