
13.7 The Cross-Licensing COP
215
an extremely wide variety of inventions, from small-scale improvements
to systems and methods to large-scale semiconductor manufacturing
equipment.
Consider, for example, two Applied Materials patents. e rst is US Patent
No.8,226,540, entitled “Conguration-based engineering data collection (EDC)
for manufacturing lines,” and has, as the title suggests, the scale of a semicon-
ductor manufacturing line—which in case you do not know, is enormous. e
second is US Patent No. 8,256,754, entitled “Li pin for substrate processing,”
and covers, as its title suggests, a li pin for liing a substrate (wafer) from a ...