Design for Excellence in Electronics Manufacturing

List of Figures

1. Figure 2.1 Reliability tools across the design and development process
2. Figure 2.2 Block diagram for a simple fuel system
3. Figure 2.3 Parallel brake system
4. Figure 3.1 Costs committed vs. money spent
5. Figure 3.2 Concurrent engineering flow
6. Figure 3.3 Reliability physics in the design phase
7. Figure 3.4 Classic bathtub curve
8. Figure 3.5 Capacitor susceptibility to wearout and breakdown. Source: Ansys-DfR Solutions
9. Figure 3.6 Variation in shipping container temperature
10. Figure 3.7 Reliability physics models
11. Figure 3.8 Hardware design process
12. Figure 3.9 Hardware design process feedback loop
13. Figure 3.10 Deep integration with existing simulation workflows. Source: Ansys-DfR Solutions
14. Figure 3.11 Initial parts placement
15. Figure 3.12 Thermal data. Source: Ansys-DfR Solutions
16. Figure 3.13 Out-of-plane displacement. Source: Ansys-DfR Solutions
17. Figure 3.14 Part selection: BOM creation flow
18. Figure 3.15 ESD entry vectors
19. Figure 3.16 Expansion and contraction behavior
20. Figure 3.17 Images of solder coarsening. Source: Ansys-DfR Solutions
21. Figure 3.18 Tin whiskers. Source: Ansys-DfR Solutions
22. Figure 3.19 Tin whisker intermetallic formation
23. Figure 3.20 Detailed geometry and mesh of traces and vias
24. Figure 3.21 Detailed view of high- and low-stress pads. Source: Ansys-DfR Solutions
25. Figure 3.22 Immersion silver galvanic etching. Source: Ansys-DfR Solutions
26. Figure 3.23 Champagne voiding. Source: Ansys-DfR Solutions
27. Figure 3.24 Creep corrosion. Source: Ansys-DfR Solutions
28. Figure 3.25 Compression ...