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Design for Excellence in Electronics Manufacturing
book

Design for Excellence in Electronics Manufacturing

by Cheryl Tulkoff, Greg Caswell
March 2021
Intermediate to advanced
400 pages
9h 52m
English
Wiley
Content preview from Design for Excellence in Electronics Manufacturing

Acronyms

2D
two‐dimensional
3D
three‐dimensional
AABUS
as agreed between user and supplier
AC
alternating current
ADA
automated design analysis
AF
acceleration factor
AFSC
Air Force Systems Command
Ag
silver
ALT
accelerated life test
AMR
absolute maximum rating
ANSI
American National Standards Institute
AOI
automated optical inspection
ASTM
American Society for Testing and Material
AVL
approved vendor list
BGA
ball grid array
BIST
built in self‐test
BOM
bill of materials
BTC
bottom termination component
C
centigrade
C0G
temperature‐stable dielectric
CAD
computer‐aided design
CAF
conductive anodic filament
CAM
computer‐aided manufacturing
CAPEX
component cost and installation expense
CAR
corrective action request
CBGA
ceramic ball grid array
CCA
circuit card assembly
CDM
charged device model
CFF
conductive filament formation
CI
continuous improvement
cm
centimeter
CM
contract manufacturer
CMOS
complementary metal oxide semiconductor
COB
chip on board
COP
computer operating properly
COTS
commercial off the shelf
CPU
central processing unit
C‐SAM
C‐mode scanning acoustic microscopy
CSP
chip‐scale package
CTE
coefficient of thermal expansion
CTQ
critical to quality
CTS
compatibility test suite
Cu
copper
CVD
chemical vapor deposition
DC
direct current
DfM
Design for Manufacturability
DFMEA
design failure modes and effects analysis
DfR
Design for Reliability
DfS
Design for Sustainability
DfT
Design for Test
DfX
Design for Excellence
DI
deionized
DIC
digital image correlation
DIP ...
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Publisher Resources

ISBN: 9781119109372Purchase Link