12.6.1. Routing for signal integrity
As the fabrication technology advances, on-chip minimum feature sizes continue to decrease, clock rates keep increasing, and devices and interconnection wires are placed in closer proximity to reduce interconnection delay and routing area. Consequently, increasing the aspect ratios of wires and decreasing interconnect spacing make the coupling capacitance larger than self-capacitance. In fact, the ratio of coupling capacitance is reported to be even as high as 70% to 80% of the total wiring capacitance, even in the 0.25-μm technology. As a result, crosstalk becomes a key issue for signal integrity.
12.6.1.1. Crosstalk modeling
Noise is an unwanted variation that makes the behavior of a manufactured circuit ...
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