12.6.3. Routing for reliability
Manufacturing reliability and yield in VLSI designs are becoming a crucial challenge as the feature sizes shrink into the nanometer scale. Both the antenna effect arising in the plasma process and the via-open defect are important issues for achieving a higher reliability and yield.
12.6.3.1. Antenna-avoidance routing
The antenna effect is caused by the charges collected on the floating interconnects, which are connected to only a gate oxide. During the metallization, long floating interconnects act as temporary capacitors and store charges gained from the energy provided by fabrication steps such as plasma etching and CMP. If the collected charges exceed a threshold, the Fowler-Nordheim (F-N) tunneling current ...
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