Manufacturing Preparation Steps

Merging Operations

Larry:Yes, there are a few more steps required. EDA tools help do these at the IC manufacturer or foundry. The design must be merged with all the underlying standard base mask layers. Those base layers include the on-chip process test pattern, the input/output (I/O) pads, and the standard electrostatic discharge (ESD) protection circuitry.
Nora:What does this ESD circuitry do?

Electrostatic Discharge Protection

Larry:The Electro-Static Discharge circuitry protects the chip I/O from electrostatic voltages. Static electricity causes the tiny sparks you create when walking across a carpet. The sparks can reach thousands of volts. Static electricity may also occur when handling the chip in the assembly ...

Get Essential Electronic Design Automation (EDA) now with O’Reilly online learning.

O’Reilly members experience live online training, plus books, videos, and digital content from 200+ publishers.