Manufacturing Preparation Steps
Merging Operations
| Larry: | Yes, there are a few more steps required. EDA tools help do these at the IC manufacturer or foundry. The design must be merged with all the underlying standard base mask layers. Those base layers include the on-chip process test pattern, the input/output (I/O) pads, and the standard electrostatic discharge (ESD) protection circuitry. |
| Nora: | What does this ESD circuitry do? |
Electrostatic Discharge Protection
| Larry: | The Electro-Static Discharge circuitry protects the chip I/O from electrostatic voltages. Static electricity causes the tiny sparks you create when walking across a carpet. The sparks can reach thousands of volts. Static electricity may also occur when handling the chip in the assembly ... |
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