7Electronic Design Automation for 3D

Paul D. Franzon

North Carolina State University, Department of Electrical and Computer Engineering, Raleigh, NC, 27606, USA

7.1 Introduction

3D‐IC and interposer technologies require modified computer aided design (CAD) flows. Issues that arise that are unique to 3D‐IC include evaluating the greater options afforded (pathfinding or design planning); vertical partitioning; design across a 3D stack, including placement, routing, and clock insertion; parasitic extraction including through‐silicon vias (TSVs) and other bonds; and managing the added complexity of DFM and test insertion. This chapter surveys these issues (except for test that is covered elsewhere in this book) with a focus on pragmatic solutions. ...

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