Handbook of 3D Integration, Volume 4

Chapter 11Pre‐Bond Testing Through Direct Probing of Large‐Array Fine‐Pitch Micro‐Bumps^*

Erik Jan Marinissen¹, Bart De Wachter¹, Jörg Kiesewetter², and Ken Smith³

¹ IMEC, Kapeldreef 75, 3001 Leuven, Belgium

² FormFactor GmbH, Süss Straße 1, 01561 Thiendorf, Germany

³ FormFactor Inc., 9100 SW Gemini Drive, Beaverton, OR 97008, USA

11.1 Introduction

There is a lot of excitement around and expectations from 2.5D‐ and 3D‐stacked integrated circuits (SICs) [1]. In 2.5D‐SICs, multiple active dies are placed side‐by‐side on top of and interconnected by a passive interposer die. In 3D‐SICs, multiple active dies are stacked vertically. Both 2.5D‐ and 3D‐SICs are enabled by the capability to manufacture through‐silicon vias (TSVs) that provide an electrical ...