19.1 Introduction: Density Scaling Drives Compute Performance and Efficiency19.2 Thermal Management Landscape for 3D‐ICs19.3 Advances on Thermal Interfaces: Percolating Thermal Underfills19.4 Single‐Phase Interlayer Cooling: Design Rules Toward Extreme 3D19.5 Applicability of Two‐Phase Cooling for 3D‐ICs19.6 Compact Thermal Modeling Framework19.7 Consequence of Fluid Presence for the Package Topology19.8 Thermal Laminates Enabling Dual‐Side Cooling and Electrical InterconnectsReferences