Handbook of 3D Integration, Volume 4

Introduction to Design, Test and Thermal Management of 3D Integrated Circuits

When we started to work on the first volume of Wiley's Handbook of 3D Integration in 2007, we intended these volumes to be an encompassing treatise on 3D integration – a new technical field of semiconductor technology and electronic systems packaging. This ambitious goal of Wiley‐VCH and the editors was achieved with the help of Christopher Bower who served as co‐editor of the first two volumes. We chose to initially focus on 3D‐IC process technology, such as fabrication of through‐silicon vias (TSVs) and wafer thinning and temporary and permanent bonding technologies.

Volume 3, released in 2014, continued coverage of new developments in process technology as future ...