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Advanced interconnection technologies for flexible organic electronic systems

M. Koyuncu, E. Lorenz,  and A. Zimmermann     Robert Bosch GmbH, Waiblingen, Germany

Abstract

Flexible electronics offers high potential for innovative products by rendering electronic hardware compatible with nonplanar surfaces. Foil-based electronics, e.g. System-in-Foil, paved the way to flexible electronics products by providing a high level of packaging density as well as a means to integrate functional diversity into a single package. Components with substantially different geometrical and mechanical properties can be integrated to form a System-in-Foil, provided the integration technologies and process flow are well designed. Component diversity brings heterogeneous ...

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