Advanced interconnection technologies for flexible organic electronic systems
Abstract
Flexible electronics offers high potential for innovative products by rendering electronic hardware compatible with nonplanar surfaces. Foil-based electronics, e.g. System-in-Foil, paved the way to flexible electronics products by providing a high level of packaging density as well as a means to integrate functional diversity into a single package. Components with substantially different geometrical and mechanical properties can be integrated to form a System-in-Foil, provided the integration technologies and process flow are well designed. Component diversity brings heterogeneous ...
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