9

Wafer-level packaging technology for RF MEMS

S. Seok,     Iemn Cnrs, France

Abstract:

This chapter discusses the wafer-scale packaging technology for radio frequency microelectromechanical systems (RF MEMS) devices. First, the need for the wafer-level packaging of RF MEMS devices and the electrical effect of the packaging cap are assessed. This chapter shows examples of different types of packaging techniques, with emphasis on wafer-level bonding using hard cap materials, such as silicon and glass, and polymer cap materials, based on benzo-cyclobutene and PerMX.

Key words

wafer-level packaging

polymer

BCB

PerMX

RF MEMS

9.1 Introduction

As microelectromechanical systems (MEMS) packaging is being recognized as an essential technique for ...

Get Handbook of Mems for Wireless and Mobile Applications now with O’Reilly online learning.

O’Reilly members experience live online training, plus books, videos, and digital content from 200+ publishers.