7.6. Techniques Based on Thin-Film SOI and Silicon Epitaxy
There are several thin-film SOI manufacturing technologies. A short description of the most important technologies follows.
7.6.1. Smart Cut Process
The Smart Cut technology is first and foremost applied in large-scale manufacturing of thin-film SOI wafers for CMOS applications. With the Smart Cut process the maximum SOI layer thickness is limited to 1.0–1.5 μm. Combined with epitaxial growth of silicon to increase the SOI layer thickness, the technique can be used to manufacture thick-film SOI wafers. The process is briefly described below; for more detailed presentation the reader is referred to the review article  and the references therein.
The Smart Cut process combines hydrogen ...