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Handbook of Silicon Based MEMS Materials and Technologies by Teruaki Motooka, Ari Lehto, Markku Tilli, Veikko Lindroos

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14.2.4. Perforated Squeeze-Film Dampers

Due the manufacturing process, etch holes are needed in relatively large MEMS surfaces above a small air gap. Also, the holes are usable in controlling the damping force. In electrostatic actuators, the holes reduce the damping force dramatically, but affect only slightly the electrical properties of the air gap. In unperforated square squeeze-film dampers the damping is proportional to L4, but in perforated dampers the force is proportional to d4, where d is the separation of the perforation holes. Figure 14.10 shows an example of a vibrating MEMS structure with perforations.

Fig 14.10. An example of a vibrating MEMS structure with perforations.

In analyzing perforated dampers, the low-frequency solution ...

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