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Handbook of Silicon Based MEMS Materials and Technologies by Teruaki Motooka, Ari Lehto, Markku Tilli, Veikko Lindroos

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22.1. Lithography Considerations Before Wafer Processing

Before the first wafer is exposed, many decisions regarding the patterning process have been fixed. These include mask design, and the actual fabrication of physical mask plates which have to be consistent with the chosen photoresist. Layout design must take into account lithographic alignment tolerances, and the layout design rules concerning minimum lines and spaces, required overlaps, recommended and/or forbidden shapes, etc. Alignment marks must be designed in the photomasks, and the sequence of alignments fixed for all the process steps.

Because linewidths are usually not an issue in MEMS devices, photomasks for contact/proximity 1X exposure tools are reasonably priced: 500 ¤/$ is ...

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