Chapter Thirty Seven. Wafer-Bonding Equipment
Observed and studied since ancient times, adhesion between two clean flat surfaces started to attract the interest of the semiconductor industry during the 1970s. Various companies introduced applications using the spontaneous adhesion between two silica or optical glass surfaces [1] as well as the electric field-assisted bonding between glass–metal (first reported in 1969 [2], known today as “anodic bonding”) or glass–silicon. These applications were typically using home-made fixtures and apparatus.
The need for dedicated wafer-bonding equipment rose in industry due to the high number of potential applications foreseen for this technology in the late 1980s. Specialized wafer-bonding equipment development ...
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