37.3.2. Room-Temperature Bond Chambers
“Clean” Bond Chambers
This type of process chamber is typically used for molecular bonding processes (known also as “direct” or “fusion” bonding) and consists of a hardware setup which has to meet very particular criteria.
An example of such a special setup is the pre-bond chamber used for silicon-on-insulator (SOI) manufacturing or for MEMS wafer-bonding applications using CMOS wafers. For this specific product the bond process and bonder hardware have to fulfill very strict requirements:
- No particle contamination (required particle levels for manufacturing: < 0.015 LPD added in pre-bond chamber, measured for 0.15 μm particle size).
- No metal ions contamination (ion levels for critical metallic elements ...
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