References

1. Gilleo K., MEMS and MOEMS packaging challenges J. Mater. Proc. Manuf. Sci. 8 4 2001, 361-379

2. Markstein H.W., Designing electronics for high vibration and shock Electronic Packag. Prod. 1987, 40-43

3. Parton E., Tilmans H., Wafer-level MEMS packaging Adv. Packag. 11 4 2002, 21-23

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