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Hot Embossing by Matthias Worgull

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References

1 D.M. Cao, W.J. Meng, Microscale compression molding of Al with surface engineered LiGA inserts Microsystem Technologies 10 2004, 662-670

2 D.M. Cao, W.J. Meng, K.W. Kelly, High-temperature instrumented microscale compression molding of Pb Microsystem Technologies 10 2004, 323-328

3 W. Ehrenstein, Polymer-Werkstoffe—Struktur, Eigenschaften, Anwendung 1999 Hanser Publishers

4 G. Fu, N.H. Loh, S.B. Tor, A variotherm mold for micro metal injection molding Microsystem Technologies 11 2005, 1267-1271

5 G. Fu, N.H. Loh, S.B. Tor, B.Y. Tay, Y. Murakoshi, R. Maeda, Analysis of demolding in micro metal injection molding Microsystem Technologies 12 2006, 554-564

6 T. Gietzelt, O. Jacobi, V. Piotter, R. Ruprecht, J. Hausselt ...

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