5.5.3.1. Post-processing Methods

A concept to realize through-holes is to optimize the molding process under the aspect of obtaining thin residual layers (Section 6.4.2). In a second process step, here post-processing, this residual layer can be removed by further processes.

Reactive Ion Etching

Reactive ion etching is an established process in microsystem technology. This process can be used for structuring substrates through an etching mask but also for the displacement of residual layers of molded parts. This replacement can be done, on the one hand, from the top via an etching mask, and on the other hand, from the back side of the molded part. These processes have been adapted to remove residual layers from molded parts [21]. The adaptation ...

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