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Hot Embossing by Matthias Worgull

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5.5.3.2. Molding on Selected Substrates

To avoid any post-processing of molded parts, through-holes should be fabricated during the embossing cycle. This can be achieved by the use of a combination of modified mold inserts and selected substrates [19]. The principle refers to a complete displacement of the residual layer in selected areas, achieved by embossing freestanding structures of mold inserts into modified substrates. This enhanced molding principle requires a sensitive set-up of the process parameters and a proper selection of the substrate materials, because of the relatively high load on the structures during molding. Here the risk of damaging filigree structures of the mold insert increases, especially when the diameter of the through-holes ...

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