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Hot Embossing by Matthias Worgull

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References

1AHahn-Schickard-Gesellschaft für angewandte Forschung e.V., Institut für Mikroaufbautechnik http://www.hsg-imat.de/ 2008

2 B. Rapp, M. Worgull, M. Heckele, A. Guber, D. Herrmann, Mikro-Heissstanzen–Erzeugung von Durchlochstrukturen in ebenen Kunststoffsubstraten Conference in Microsystem Technology 2005 Freiburg i. Br. Germany

3 N. Bogdanski, H. Schulz, M. Wissen, H.-C. Scheer, J. Zajadacz, K. Zimmer, 3D-hot embossing of undercut structures–an approach to microzippers Microelectronic Engineering 73–74 2004, 190-195

4 B. L. Carvalho, E. A. Schilling, N. Schmid, and G. J. Kellog. Soft embossing of microfluidic devices. In Proceedings of 7th International Conference on Miniaturized Chemical and Biochemical Analysis Systems ...

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