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Hot Embossing by Matthias Worgull

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References

1 Mikrosystemtechnik für Ingenieure 1997 VCH Verlagsgesellschaft ISBN 3-527-29405-8

2 D.M. Cao, J. Jiang, W.J. Meng, J.C. Jiang, W. Wang, Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining Microsystem Technologies 13 5 2007, 503-510

3 D.M. Cao, J. Jiang, R. Yang, W.J. Meng, Fabrication of high-aspect-ratio microscale mold inserts by parallel μEDM Microsystem Technologies 12 9 2006, 839-845

4 B. Denkena, H.-W. Hoffmeister, M. Reichstein, S. Illenseer, M. Hlavac, Micro-machining processes for microsystem technology Microsystem Technologies 12 2006, 659-664

5 E.W. Becker, W. Ehrfeld, P. Hagmann, A. Manera, D. Muenchmeyer, Fabrication of microstructures with high aspect ...

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