Hybrid Micromachining and Microfabrication Technologies

9Ultrasonic Vibration-Assisted Microwire Electrochemical Discharge Machining

Sandip Kunar^1,2*, Kagithapu Rajendra^1,2, Devarapalli Raviteja^1,2, Norfazillah Talib³, S. Rama Sree^2,4 and M.S. Reddy^1,2

¹Department of Mechanical Engineering, Aditya Engineering College, Surampalem, India

²Jawaharlal Nehru Technological University Kakinada, Kakinada, East Godavari, India

³Department of Manufacturing Engineering, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, Johor, Malaysia

⁴Department of Computer Science and Engineering, Aditya Engineering College, Surampalem, India

Abstract

The necessity for glass microstructure is rising as microelectromechanical systems (MEMSs) develop so quickly. Ultrasonic vibration is used in the microwire electrochemical discharge machining (WEDM) to attain superior quality of machining for glass microstructures. This means that by increasing the appropriate ultrasonic amplitude, the width of the gas film was decreased, lowering the critical voltage, and improving the machining stability. Then, a series of tests are performed using a micro helical electrode with 100 µm diameter to examine the influence of duty factor, ultrasonic amplitude, voltage, and frequency on the micro slit width. The investigational findings demonstrate that by including an appropriate ultrasonic amplitude and machining quality are greatly enhanced. The average slit width was decreased to 128.63 µm when the amplitude was 5.25 µm. ...