IBM PureFlex System and IBM Flex System Products and Technology

65

4.1.7 Hot plug and hot swap components

The chassis follows the standard color coding scheme used by IBM for touch points and hot

swap components.

Touch points are blue, and are found on these locations:

򐂰 The fillers that cover empty fan and power supply bays

򐂰 The handle of nodes

򐂰 Other removable items that cannot be hot swapped

Hot Swap components have orange touch points. Orange tabs are found on fan modules, fan

logic modules, power supplies, and I/O Module handles. The orange designates that the

items are hot swap, and can be both removed and replaced while the chassis is powered.

Table 4-4 shows which components are hot swap and which are hot plug.

Nodes can be plugged into the chassis while the chassis is powered. The node can then be

powered on. Power the node off before removal.

Table 4-4 Hot plug and hot swap components

4.2 Power supplies

A maximum of six power supplies can be installed within the Enterprise Chassis. The power

supplies are 80 PLUS Platinum certified and are 2500 Watts output rated at 200VAC to

208VAC (nominal), and 2750W at 220VAC to 240VAC (nominal). The power supply has an

oversubscription rating of up to 3538 Watts output at 200VAC. The power supply operating

range is 200-240VAC. The power supplies also contain two independently powered 40mm

cooling fan modules that use power from the midplane, not from the power supply.

80 PLUS is a performance specification for Power Supplies used within servers and

computers. The standard has several ratings, such as Bronze, Silver, Gold, Platinum. To meet

the 80 PLUS Platinum standard, the Power Supply must have an efficiency equal to or greater

than 90% at 20% of rated load, 94% at 50% of rated load and 91% at 100% of rated load with

a power factor (PF) of 0.95 or greater at 50% rated load.

Further information about 80 PLUS can be found at

http://www.80PLUS.org

Component Hot plug Hot swap

Node

Ye s N o

a

a. Node must be powered off, in standby before removal.

I/O Module

Ye s Ye s

b

b. I/O Module might require reconfiguration, and removal is disruptive to any communications that

are taking place.

40 mm Fan Pack

Ye s Ye s

80 mm Fan Pack

Ye s Ye s

Power Supply

Ye s Ye s

Fan logic module

Ye s Ye s

66 IBM PureFlex System and IBM Flex System Products and Technology

Table 4-5 lists the efficiency of the Enterprise Chassis power supplies at various percentage

loads.

Table 4-5 Enterprise Chassis 2500W power supply efficiency at different loads

Figure 4-8 shows the location of the power supplies.

Figure 4-8 Power supply locations

The chassis allows configurations of power supplies to give N+N or N+1 redundancy. A fully

configured chassis operates on just three 2500W power supplies with no redundancy, but

N+1 or N+N is better to keep the chassis available. Three (or six with N+N redundancy) power

supplies allows for a balanced 3-phase configuration.

All power supply modules are combined into a single power domain within the chassis. This

combination distributes power to each of the compute nodes, I/O modules, and ancillary

components through the Enterprise Chassis midplane. The midplane is a highly reliable

design with no active components. Each power supply is designed to provide fault isolation

and is hot swappable.

Power monitoring of both the DC and AC signals allows the Chassis Management Module to

accurately monitor the power supplies.

The integral power supply fans are not dependent upon the power supply being functional.

They operate and are powered independently from the midplane.

Percentage load Percentage efficiency

100% 92%

50% 95%

20% 93%

10% 90%

Power

supply

bay 6

Power

supply

bay 5

Power

supply

bay 4

Power

supply

bay 1

Power

supply

bay 3

Power

supply

bay 2