IBM Tape Solutions for Storage Area Networks and FICON

Chapter 3. SAN building blocks 41

򐂰 Support for high-speed data traffic with the Performance Bundle feature, which provides

ISL trunking and performance monitoring (Up to four ISLs can be combined for throughput

capability of up to 8 Gbps.)

򐂰 Cascading support for flexibility in creating scalable fabric topologies

򐂰 Distributed fabric services such as name serving, zoning, routing, and microcode upgrade

򐂰 The IBM TotalStorage SAN Switch Specialist, which provides a comprehensive set of

management tools that support a Web browser interface for flexible, easy-to-use

operations

3.6.2 Hardware components

The 2109 Model F16 system board is a single-board design with a highly integrated central

processing unit (CPU). The Intel 80960VH CPU is a RISC core processor and is the top

choice for this platform. It provides over 70% of the functionality for the digital section of the

system board. The system uses three types of memory devices: DRAM, Flash File, and Boot

Flash. On the Fibre Channel section of the system board, the Bloom application-specific

integrated circuit (ASIC), the Serializer/Deserializer (SERDES), and the SFP media are the

key components that provide high-speed data transfer. The SFP media interfaces support

shortwave laser (SWL) and longwave laser (LWL).

The system chassis is a 1U height enclosure with space for two power supply units and one

system board. The system board is placed in an Electromagnetic Interference (EMI)

enclosure tray as an EMI-proof system unit. Two 126-watt removable, redundant power

supplies provide hot-swappable capability. Cooling fans are mounted in the rear to provide

airflow for system cooling.

CPU subsystem

An Intel 80960VH CPU is used for switch initialization and management functions. The CPU

runs the Fabric OS and is responsible for switch initialization, configuration, and

management. IBM-designed ASICs provide the switching functionality.

The following peripherals are also supported:

򐂰 An Ethernet port

򐂰 A serial port

򐂰 Three digital thermometers

򐂰 A real-time clock

򐂰 Two power supply controls

򐂰 General I/O

The CPU subsystem is a mixed voltage system using 1.8 V, 2.5 V, 3.3 V, and 5 V depending

on the device. The maximum board power consumption is 78 W.

Features

The 2109-F16 CPU subsystem includes the following features:

򐂰 A 80960VH-100 MHz CPU

򐂰 A SDRAM controller with parity check at 33 MHz

򐂰 A Peripheral Control Interconnect (PCI) bus arbiter

򐂰 An on-board SDRAM with data parity to support a 16 MB configuration

򐂰 One PLCC32 Boot Flash socket to support up to 512 KB of Flash memory

򐂰 8 MB (2 x 4 MB) Flash memory for software storage

򐂰 10BASE-T or 100BASE-T port for management connection with RJ45 connector

򐂰 One RS232 port with DB9 connector

򐂰 16 LEDs to indicate the status for each port