book

Industrial Applications of Lasers, 2nd Edition

by John F. Ready

April 1997

Intermediate to advanced

599 pages

19h 52m

English

Academic Press

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A. Electromagnetic RadiationB. Elementary Optical PrinciplesC. Energy LevelsD. Interaction of Radiation and MatterE. Laser MaterialsF. Population InversionG. Resonant Cavity
A. LinewidthB. CollimationC. Spatial Profiles of Laser BeamsD. Temporal Behavior of Laser OutputE. CoherenceF. RadianceG. Focusing Properties of Laser RadiationH. Power

A. Gas LasersB. Solid State LasersC. Semiconductor LasersD. Organic Dye Lasers
A. Semiconductor LasersB. Diode-Pumped Solid State LasersC. Chemical LasersD. Free Electron LasersE. X-Ray LasersF. Optical Parametric OscillatorsG. Tunable Lasers
A. MirrorsB. OpticsC. PolarizersD. Infrared MaterialsE. DetectorsF. ModulatorsG. Light Beam DeflectorsH. Q-switchesI. Nonlinear Optical ElementsJ. Optical IsolatorsK. Raman ShiftersL. Injection SeedersM. Beam ProfilersN. Optical TablesO. Spatial Light ModulatorsP. Beam Homogenizers
A. Damage and Deterioration of LasersB. Care and Maintenance
A. Physiological EffectsB. Laser Safety Practices and Standards
A. Position-Sensitive DetectorsB. Laser ToolingC. Angle TrackingD. Lasers in Construction
A. The Michelson InterferometerB. Beat Production (Heterodyne)C. The Doppler EffectD. Coherence Requirements
A. Interferometric Distance MeasurementB. Laser Doppler DisplacementC. Beam Modulation TelemetryD. Pulsed Laser Range FindersE. A Laser Interferometer Application in Mask Production: A Specific Example of Distance Measurement and Dimensional Control
A. Velocity MeasurementB. Angular Rotation RateC. Diffractive Measurements of Small Dimension: Wire DiameterD. Profile and Surface Position MeasurementE. Measurement of Product DimensionF. Measurement of Surface FinishG. Particle Diameter MeasurementH. Strain MeasurementI. VibrationJ. Cylindrical Form MeasurementK. Defect DetectionL. Surface Flaw Inspection Monitor: A Specific ExampleM. Summary
A. Seam Welding: Subkilowatt LevelsB. Welding with Multikilowatt LasersC. Spot WeldingD. Specific Examples of Laser Welding CapabilityE. Summary
A. HardeningB. GlazingC. Laser AlloyingD. Laser CladdingE. Specific Examples of Laser Heat Treating Capability
A. Laser-Induced Material RemovalB. Hole DrillingC. CuttingD. ScribingE. MarkingF. BalancingG. Paint StrippingH. Laser Deposition of Thin FilmsI. Specific Examples of Material Removal
A. Established Applications in ElectronicsB. Applications in Integrated Circuit FabricationC. SummaryD. A Specific Example: Laser-Based Photomask Repair
A. Formation of HologramsB. The Holographic ProcessC. Hologram Types and EfficiencyD. Practical Aspects of Holography
A. Holographic InterferometryB. Miscellany of ApplicationsC. Holographic Optical ElementsD. An Example of Holographic Application
A. Lasers for Spectroscopic ApplicationsB. Types of Laser SpectroscopyC. Applications of Laser Spectroscopy
A. Laser-Initiated ReactionsB. Laser-Altered ReactionsC. Laser Monitoring of Chemical DynamicsD. Isotope Separation
A. StructuresB. LossesC. Manufacture of Optical FibersD. Connectors, Splicing, and CouplersE. Fiber AmplifiersF. Infrared-Transmitting FibersG. Fiber Optic SensorsH. Summary
A. Optical WaveguidesB. Components for Integrated OpticsC. Integrated Optic CircuitsD. Applications
A. Lightwave CommunicationsB. Optical Data StorageC. Optical Data ProcessingD. Laser GraphicsE. Consumer Products

Content preview from Industrial Applications of Lasers, 2nd Edition

Chapter 16

Applications for Material Removal: Drilling, Cutting, Marking

In the last two chapters, we described applications for laser-induced heating and melting. In those applications one generally tries to avoid vaporization and material removal. In this chapter, we emphasize applications that require material removal. Generally, this means operation at higher levels of laser irradiance delivered to the workpiece compared with the operating levels for welding and surface treatment. We will describe a variety of different applications, including hole drilling, cutting, and marking, but we shall not discuss the uses in fabrication of electronic components. This will be left to the next chapter.