Applications for Material Removal: Drilling, Cutting, Marking
In the last two chapters, we described applications for laser-induced heating and melting. In those applications one generally tries to avoid vaporization and material removal. In this chapter, we emphasize applications that require material removal. Generally, this means operation at higher levels of laser irradiance delivered to the workpiece compared with the operating levels for welding and surface treatment. We will describe a variety of different applications, including hole drilling, cutting, and marking, but we shall not discuss the uses in fabrication of electronic components. This will be left to the next chapter.
A. Laser-Induced Material Removal
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