The family of front-end technologies collects all the technologies that are meant to build a chip, or a three-dimensional structure in MEMs case, that has to perform a well-defined function. Back-end processes are, on the contrary, all the processes that start from the final chip to condition it, so as to allow its practical use. This kind of conditioning is, for example, constituted by closing the chip in a suitable package so as to protect it from environmental damages, creating through the package the interfaces to connect the chip to external sources and sinks of chemical substances and signals (both optical and electrical), providing suitable chip thermal stabilization, and so on.
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