
7-16 Sensors and Sensor Technology
TABLE 7.4 Materials and Devices Necessary for Needle-Type Environmental MEMS Sensor Array Fabrication
Item Use Description Sources
Borosilicate
g
lass
wa
fer •
Co
re
s
tructure
ma
terial
f
or
w
orking
ele
ctrode
•
175 μ
m
t
hick,
45 mm ×
50 mm
• Erie S
cientic,
Pi
ttsburgh,
P
A
Dicing
s
aw •
Cu
t
in
dividual
g
lass
pr
obes
•
45 μ
m
di
amond
g
rit
resin
oid
b
lades
(Micr
oSwiss)
•
K&S (740)
P
rogrammable box furnace • Anneal glass wafers to
relieve stress from the
dicing process
• Use cooling steps to
re
duce
t
hermal
s
hock
• Programmable target
temperature and hold
time
• Reliable uniform
tem
perature
in
side
fur
nace
• ermo Scientic,
Norwood, ...