
679Planar Transmission Lines
steps involved in their fabrication process are discussed in Section 16.6. The
realisation of some of these is briey discussed below.
15.9.1 Resistors
Resistors on MICs use a deposited resistive layer. These are fabricated either
with thin lm (sputtering) technique or by thick lm printing. Tantalum
nitride, cermets and nickel chrome are the most commonly used materials.
These are further discussed in Section 16.7.1.
15.9.2 Inductors
The availability of good inductors is one of the shortcomings of standard IC
processes, particularly at higher frequencies. The synthesised active RF cir-
cuits always have higher ...