Book description
Silicon technology is evolving rapidly, particularly in board-to-board or chip-to chip applications. Increasingly, the electronic parts of silicon technology will carry out the data processing, while the photonic parts take care of the data communication. For the first time, this book describes the merging of photonics and electronics in silicon and other group IV elements. It presents the challenges, the limitations, and the upcoming possibilities of these developments. The book describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics, including the reasons for its rapid expansion, its possibilities and limitations. It discusses the applications of these technologies for such applications as memory, digital logic operations, light sources, including drive electronics, optical modulators, detectors, and post detector circuitry. It will appeal to engineers in the fields of both electronics and photonics who need to learn more about the basics of the other field and the prospects for the integration of the two.
- Combines the topics of photonics and electronics in silicon and other group IV elements
- Describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics
Table of contents
- Cover image
- Title page
- Copyright
- Acknowledgments
- Introduction: Scope and Purpose of Book
- Epigraph
- Chapter 1. Metal Oxide Semiconductor Field Effect Transistors
-
Chapter 2. Basics of Integrated Photonics
- General
- Basics of Lasers, Modulators, Detectors, and Wavelength Selective Devices
- Basics of Photonic Detectors
- Detector Characteristics
- Responsivity
- Dark Current
- Noise Characteristics of Photodetectors
- Modulators: Principles and Mechanisms of Optical Modulation
- Photonics Switches: Spatial Routing of High-Speed Data Streams
- References
- Chapter 3. Silicon and Group IV Photonics
-
Chapter 4. Moore’s Law for Photonics and Electronics
- Downscaling of CMOS
- Evolution of Logic CMOS Since 1970
- Transistor Physical Parameters
- Lithography
- Strain Engineering and Downscaling
- Gate Electrode
- Gate Dielectric
- Contact Resistance
- Substrate Design
- Heat Production
- Short Channel Effects
- Drain-Induced Barrier Lowering
- Punch Through
- Mobility Degradation
- Velocity Saturation
- Hot Electron Effect
- 3D Chips, New Vision for Downscaling
- Downscaling for Next 30 Years
- Moore’s Law for Integrated Photonics Devices and Some Vision for the Future
- References
- Chapter 5. Complementing Silicon With Other Materials for Light Emission, Efficient Light Modulation and Subwavelength Light Confinement
Product information
- Title: Monolithic Nanoscale Photonics-Electronics Integration in Silicon and Other Group IV Elements
- Author(s):
- Release date: September 2014
- Publisher(s): Academic Press
- ISBN: 9780124199965
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