CONTENTS
11.1 Current Status of Data Storage
11.3 Electrothermal Models for PCM Devices
11.3.1.1 Electrical Conductivity
11.3.1.3 Thermal Boundary Resistance
11.3.1.4 Heat Capacity and Latent Heat of Fusion
11.4.1 Effect of Electrical Resistivity
11.5 PCM Design and High-Temperature Nanoelectronics
11.1 CURRENT STATUS OF DATA STORAGE
Demand ...
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