
198 Nanosensors: Physical, Chemical, and Biological
Daughter stamps are manufactured by extending the overplating to form a
sizeable supporting base. Thus, a robust metal stamp, capable of withstand-
ing repeated use and high mechanical loads, is constructed.
3.4.12 Combination of MEMS/NEMS and CMOS Processes
The hybrid approach in which the MEMS/NEMS devices and CMOS cir-
cuits are fabricated independently and connected together afterward is the
most primitive method. There are three distinct approaches of fabrication
of MEMS components along with interface electronics on the same chip: (i)
Preprocessing: in which wells are etched up