
10.5 NETWORK ARCHITECTURE IMPACT
OF LSI PICs
10.5.1 Component Consolidation Advantages
The 100 Gb/s Tx LSI module integrates 10 channels of DFB lasers, modulators,
power monitors, VOAs, and wavelength-locking elements multiplexed with a low-
loss AWG. It is mounted in a Tx module, complete with digital drive electronics,
ADC, wave locking, FEC, power monitoring, TEC temperature control functions,
and a single fiber output (Figure 10.22).
The 100-Gb/s Rx PIC integrates a polarization-insensitive de-multiplexing AWG
with 10 channels of photodiodes. It is packaged in a separate module with a single
fiber input. DFB laser thresholds, output power, wavel