Physical Design for 3D Integrated Circuits

11	Exploration of the Thermal Design Space in 3D Integrated Circuits Sumeet S. Kumar, Amir Zjajo, and Rene van Leuken

CONTENTS

Abstract

11.1  Introduction

11.2  Significance of Design Parameters

11.3  Exploration Flow

11.3.1  TSV Topology Exploration

11.3.2  Thermal Conductivity Estimation

11.3.3  Thermal Simulation

11.4  Experimental Setup and Validation

11.5  Exploration Results

11.5.1  Influence of Thermal Conductivity

11.5.2  Influence of Die Thickness and Stack Depth

11.5.3  Influence of Power Density

11.6  Conclusions

Acknowledgments

References

ABSTRACT

The complex nature of heat flow within 3D integrated circuits (IC) results in nonuniform operating temperatures throughout the die stack, and, consequently, in the formation of performance-degrading ...