Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs |
CONTENTS
16.2 High-Speed Interconnects for 3D-ICs Utilizing Inductive Coupling
16.2.1 Transceiver Design and Its Signaling Scheme
16.2.2 Inductor Design and Implementation
16.3 High-Speed Interconnects for 3D-ICs Utilizing Capacitive Coupling
16.3.1 Modeling of Capacitive Coupling Interconnect
16.4 High-Speed Interconnects for Silicon Interposer-Based 2.5D-ICs
ABSTRACT
Transistor scaling has developed the semiconductor industry over the last few decades. However, as the lithography ...
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